Benefits Include Increased Performance, Reduced Power Needs and Enhanced Miniaturization
The global 3D IC (three-dimensional integrated circuit) market will reach a value of $22.30 Billion by 2027. The increasing demands for smart devices and the importance of miniaturization in the electronics industry are influencing the market growth.
As it's become more difficult to shrink existing processes, stacking up is the way to increase integration. Stacking can be done die-on-die, die-on-wafer, wafer-on-wafer, or in combination.